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System in Package (SiP)

  • Overview

Solution Integrated Product™

 

  • Design Free for High Frequency Bus
  • Reduction for EMI Noise
  • Low Cost NRE, QTAT Development
  • Standardization for Customer System Board and Cost Saving (Save Total Cost)
  • Large Density Memory
  • Same Quality Level Support as Semiconductor Component
  • Easy for Purchasing Products and Improvement of Overseas Productivity of Product Line

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